With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semi-conductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers. Today Keylink is recommending two heat sinks KHSF90A and KHSF150A for your power amplifier module. KeyLink's aluminum finned heat sink specially designed to match our RF power amplifier module for heat dissipa
Precisely guided by Microwave Radar, Shenzhou11 rendezvoused and docked with Tiangong2 perfectly on the early morning of the 19th. This is the fourth perfect perfomance of rendezvous and docking microwave radar after Shenzhou 8、Shenzhou 9 and Shenzhou 10 docking with Tiangong 1. The rendezvous and docking microwave radar system for this mission includes microwave radar and microwave transponder. The microwave transponder in Tiangong 2 is the second generation product, which has miniaturization improvement and is better and more reliable than the first. At the same time, it added the communication function, which makes the integration of the measurement and the communication realized. The volume and weight of the second microwave transponder is half of the original, and the power consumpti on is 60% of the original. This news comes from Keylink Microwave. We provide RF amplifier and related services.