With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semi-conductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers. Today Keylink is recommending two heat sinks KHSF90A and KHSF150A for your power amplifier module. KeyLink's aluminum finned heat sink specially designed to match our RF power amplifier module for heat dissipa
In the forthcoming five years, The revolutionary transformation of the communications industry to the 5G era is reshaping the RF (Radio Frequency) industry. This is not only for the smartphone market, but also for 3W applications, RF communications infrastructure applications, and 5G will bring significant market opportunities for compound semiconductor technology in the RF power amplifier market. Now, We are at the critical point where the 4G network is mature and transitioning to the 5G network, and there are still a lot problems to be worked out, but it is certain that the new radio network will require more devices and higher frequencies. The growth of the base station market and the overall RF infrastructure market is accompanied by significant technological changes.We will see,GaN will replace LDMOS gradually in the deployment of all the 3.5GHz macro base station. In future network design, new technologies such as carrier aggregation and MIMO will be adopted, and GaN will