With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semi-conductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers. Today Keylink is recommending two heat sinks KHSF90A and KHSF150A for your power amplifier module. KeyLink's aluminum finned heat sink specially designed to match our RF power amplifier module for heat dissipa
In a communication system, the mixer (frequency converter) plays a key role. The mixing circuit includes three components: local oscillator, nonlinear device and band-pass filter. The purpose of mixing is to ensure that the receiver obtains higher sensitivity, sufficient amplification and appropriate passband, and can work stably at the same time. Therefore, there are some requirements for the performance of the mixer : ① frequency stability, especially for up-converter, must ensure the emission carrier frequency index requirements. Taking INTELSAT as an example, the specified frequency tolerance of various transmitting carriers is shown in Table 1. In order to meet the requirements in Table 1, the local oscillators in the upconverter all use crystal oscillators with high stability. First, second, local oscillator adopts frequency synthesis phase lock technology. ② Easy to change operating frequency. In the international satellite communication system, the satellite circuit business is