With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semi-conductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers. Today Keylink is recommending two heat sinks KHSF90A and KHSF150A for your power amplifier module. KeyLink's aluminum finned heat sink specially designed to match our RF power amplifier module for heat dissipa
During 4-9 June 2017, the 2017 International Microwave Symposium(IMS) will be held in Honolulu, Hawaii. KeyLink Microwave will exhibit our new products, and one of our engineers will have a presentation during the time of Exhibitor Workshop on Wednesday 7 June 2017. Welcome to join us! We are looking forward to seeing you on booth 1049. If you would like to arrange a meeting with us there, please call our colleagues, we prepared exquisite gifts for you! Cel.: 0086-18109037151 E-mail: sales@keylinkmw.com Skype: keylinkmw www.keylinkmw.com More information about Sviaz can be found at www.keylinkmw.com We provide RF amplifier and related services. keylink microwave in IMS2017 Keylink's engineer's presentation in IMS2017