With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semi-conductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers. Today Keylink is recommending two heat sinks KHSF90A and KHSF150A for your power amplifier module. KeyLink's aluminum finned heat sink specially designed to match our RF power amplifier module for heat dissipa
The model KB80120M47A is a high power amplifier operating between 8000 MHz and 12000 MHz and offering a wide dynamic Range with 50 Watts typical saturated power. The employment of advanced high power devices in manufacturing ensures this module exceptional power performance, long term reliability and high efficiency. It is ideal for broadband high power X Band linear applications. FEATURES: Small Size 160x120x22mm [6.3x4.7x0.86 inch]; light weight 0.94 kg; Instantaneous ultra broadband; 50 Ohms input and Output matched; Built-in control and protection circuits. TYPICAL APPLICATIONS: » Jamming system; » Test equipment; » Communication systems. We provide RF amplifier and related services.