With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semi-conductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers. Today Keylink is recommending two heat sinks KHSF90A and KHSF150A for your power amplifier module. KeyLink's aluminum finned heat sink specially designed to match our RF power amplifier module for heat dissipa
SWaP solutions for many applications including EW jammers and EMC, test measurement
KeyLink ’s new solid-state GaN-based power amplifier, KB60180M45B, covers the full 6.0 to 18.0 GHz band ,providing 30-Watts output power with a drive level of 0dBm. The compact size of 200-mm (L) x 90-mm (W) x 22-mm (H) offers RF/Microwave designers an excellent choice for SWaP solutions in many applications, including EW jammers, and for EMC & test measurement.
We can provide you with a complete test report. For more details, please contact our sales.
Tel: 0086-28- 87870761
Email: sales@keylinkmw.com/info@keylinkmw.com
We provide RF amplifier and related services.
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