With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semi-conductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers. Today Keylink is recommending two heat sinks KHSF90A and KHSF150A for your power amplifier module. KeyLink's aluminum finned heat sink specially designed to match our RF power amplifier module for heat dissipa
The KB60180S43A is a bench top unit incorporating a 220V power supply and a built in forced air-cooling system. It utilizes our honorable domestic GaN power device that provides excellent power density, high efficiency, low distortion and wide dynamic range. The compact 2U design is friendly for handling and easy to stack on the bench for testings. The humanized UI design provides you convenient and smooth operating experience. Contact KeyLink sales team immedaitely for quotation at info@keylinkmw.com We provide RF amplifier and related services.